New and improved materials with varying stiffness and strength properties in addition to improving on current processes and efficiencies. We also keep a keen eye on what is going on in R&D, listening closely to new applications for our existing processes. Our commitment is not only to stay up-to-date with technological advances, but to continually expand our knowledge of these developments for future use. In doing so, we can bring greater value to your projects.
The RePliForm Technology Process
The design and build phases are very critical. This allows room for the additional plating as well as designing a structural that will be strong enough as an end product. Various materials will be affected by our process differently, so it is very important to let us know as to the exact resin type and machine you are planning to use to build the parts. RePliForm collaborates with our customers to do everything from offsetting of the surfaces to designing braces for parts to keep them from deforming. These are just a couple of examples, so please let us know what your needs are so we can help to ensure that the build will be appropriate for the plating process.
RePliForm uses an electrolytic and some electroless plating process
The plating thickness will be dependent on which process is used. RePliForm uses both copper and nickel, we can customize the thicknesses between the two metals to achieve a certain goal. If a part is for EMI Shielding we will put more copper than nickel, and if the part needs to be stiff, we will put more nickel than copper on the part. If we know the end function of the part we will be happy to advise you as to the plating thickness along with the ratio between copper and nickel to achieve your goal. The 3D Printing field has so much untapped potential, let’s find it together!